cystech electronics corp. spec. no. : c472f2 issued date : 2009.11.12 revised date : page no. : 1/4 MUR1060F2 cystek product specification 10amp. ultrafast plastic rectifiers i f(av) 10a MUR1060F2 v rrm 600v i fsm 120a trr 60ns tj 175 c features ? 175 operating junction temperature v f(max) 1.5v ? glass passivated chip junction ? low leakage current ? low switching loss, high efficiency ? high forward surge capability ? insulating package, in sulating voltage=2500v ac ? high temperature soldering guaranteed : 260 /40s, 0.25?(6.35mm) from case ? pb-free lead plating package mechanical data ? case: ito-220ac molded plastic ? mounting position: any ? weight: 1.85 grams, 0.065 ounce approximately ? terminals: pure tin plated, sold erable per j-std-002 and jesd22-b102 ? epoxy: ul 94v-0 rate flame retardant ? mounting torque: 10 in.-lb. maximum equivalent circuit outline ito-220ac MUR1060F2 k a
cystech electronics corp. spec. no. : c472f2 issued date : 2009.11.12 revised date : page no. : 2/4 MUR1060F2 cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 600 v maximum rms voltage v rms 420 v maximum dc blocking voltage v dc 600 v maximum instantaneous forward voltage at i f =10a v f 1.25 1.5 v maximum average forward rectified current @ t c =100 i f(av) 10 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 120 a v r =600 v, t c =25 10 maximum instantaneous reverse current at v r =600 v, t c =125 i r 100 a maximum reverse recovery time i f =1a, v r =30v, di f /dt=100a/ s trr 60 ns typical junction capacitance @ f=1mhz and applied 4v reverse voltage c j 80 pf isolation voltage from terminal to heatsink, t=1minute v ac 2500 v storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 4 c/w maximum thermal resistance, junction-to-ambient r th,j-a 60 c/w ordering information device package shipping MUR1060F2 ito-220ac (rohs compliant package) 50 pcs / tube, 40 tubes/box
cystech electronics corp. spec. no. : c472f2 issued date : 2009.11.12 revised date : page no. : 3/4 MUR1060F2 cystek product specification characteristic curves forward current derating curve 0 2 4 6 8 10 12 0 25 50 75 100 125 150 175 case temperature---t c () average forward current---io(a) resistive or inductive load forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 0 100 200 300 400 500 600 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 tj=25 tj=125 junction capacitance vs reverse voltage 10 100 1000 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz per leg
cystech electronics corp. spec. no. : c472f2 issued date : 2009.11.12 revised date : page no. : 4/4 MUR1060F2 cystek product specification ito-220ac dimension marking: logo device name date code 1 2 k a 2-lead ito-220ac plastic package cystek package code: f2 style: pin 1.cathode 2.anode *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.178 0.194 4.53 4.93 h1 0.256 0.272 6.50 6.90 b 0.028 0.036 0.71 0.91 j1 0.101 0.117 2.56 2.96 c 0.014 0.021 0.36 0.53 l 0.487 0.503 12.37 12.77 d 0.617 0.633 15.67 16.07 1 0.117 0.133 2.98 3.38 e 0.274 0.408 6.96 10.36 b1 0.045 0.055 1.15 1.39 f 0.092 0.108 2.34 2.74 l1 0.088 0.104 2.23 2.63 e *0.200 *5.08 k 0.122 0.138 3.10 3.50 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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